Citations are generated automatically from bibliographic data as a convenience and may not be complete or accurate.
Office of the Federal Register, National Archives and Records Administration. "DCPD-202400273 - Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act". Government. Office of the Federal Register, National Archives and Records Administration, April 8, 2024. https://www.govinfo.gov/app/details/DCPD-202400273
Office of the Federal Register, National Archives and Records Administration. (2024, April 8). DCPD-202400273 - Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act. [Government]. Office of the Federal Register, National Archives and Records Administration. https://www.govinfo.gov/app/details/DCPD-202400273
Office of the Federal Register, National Archives and Records Administration. DCPD-202400273 - Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act. Office of the Federal Register, National Archives and Records Administration, (8 Apr 2024), https://www.govinfo.gov/app/details/DCPD-202400273
Office of the Federal Register, National Archives and Records Administration, Statement on the Preliminary Funding Agreement Between the Department of Commerce and Taiwan Semiconductor Manufacturing Company Under the CHIPS and Science Act, GovInfo, (April 8, 2024), https://www.govinfo.gov/app/details/DCPD-202400273