United States Government Publishing Office publisher pbl distributor dst United States National Archives and Records Administration Office of the Federal Register author aut Government Organization text government publication eng FR Regulatory Information 2011_register executive 2011-09-27 article Rules and Regulations D09002ee1c7ff3ee8 D09002ee1c7ff3f7c United States Environmental Protection Agency originator org United States Government Agency or Subagency EPA is issuing a regulation to amend the calculation and monitoring provisions in the Electronics Manufacturing portion of the Greenhouse Gas Reporting Rule for the "largest" semiconductor manufacturing facilities (i.e., those that fabricate devices on wafers measuring 300 millimeters or less in diameter and that have an annual manufacturing capacity of greater than 10,500 square meters). More specifically, for reporting years 2011, 2012, and 2013, these amendments allow the largest semiconductor facilities the option to calculate emissions using default emission factors already contained in the regulations, instead of recipe-specific utilization and by-product formation rates for the plasma etching process type. In addition, this action extends two deadlines in the provisions related to the use of best available monitoring methods. 76 FR 59542 https://www.govinfo.gov/app/details/FR-2011-09-27/2011-24364 2011-24364 fr27se11-9 RIN 2060-AR26 6560-50-P EPA-HQ-OAR-2009-0927 FRL-9469-3 https://www.govinfo.gov/app/details/FR-2011-09-27/2011-24364 https://www.govinfo.gov/content/pkg/FR-2011-09-27/html/2011-24364.htm https://www.govinfo.gov/content/pkg/FR-2011-09-27/pdf/2011-24364.pdf Environmental Protection Administrative Practice and Procedures Air Pollution Control Monitoring Reporting and Recordkeeping 10 p. 59542 59551 76 FR 59542 Title 40 Part 98 40 CFR Part 98 RIN 2060-AR26 Mandatory Reporting of Greenhouse Gases: Changes to Provisions for Electronics Manufacturing To Provide Flexibility; Federal Register Vol. 76, Issue RULE 2011-24364 ENVIRONMENTAL PROTECTION AGENCY 2011-09-30 EPA-HQ-OAR-2009-0927 FRL-9469-3 6560-50-P 2011-24364 Final rule.

EPA is issuing a regulation to amend the calculation and monitoring provisions in the Electronics Manufacturing portion of the Greenhouse Gas Reporting Rule for the "largest" semiconductor manufacturing facilities (i.e., those that fabricate devices on wafers measuring 300 millimeters or less in diameter and that have an annual manufacturing capacity of greater than 10,500 square meters). More specifically, for reporting years 2011, 2012, and 2013, these amendments allow the largest semiconductor facilities the option to calculate emissions using default emission factors already contained in the regulations, instead of recipe-specific utilization and by-product formation rates for the plasma etching process type. In addition, this action extends two deadlines in the provisions related to the use of best available monitoring methods.

This final rule is effective on September 30, 2011. Ms. Carole Cook, Climate Change Division, Office of Atmospheric Programs (MC-6207J), Environmental Protection Agency, 1200 Pennsylvania Avenue, NW., Washington DC 20460; Environmental Protection Administrative Practice and Procedures Air Pollution Control Monitoring Reporting and Recordkeeping Mandatory Reporting of Greenhouse Gases: Changes to Provisions for Electronics Manufacturing to Provide Flexibility , GHGReportingRule@epa.gov http://www.epa.gov/climatechange/emissions/ghgrulemaking.html http://www.epa.gov/climatechange/emissions/responses.html http://www.regulations.gov Vol. 76, no. 187 Office of the Federal Register, National Archives and Records Administration 2011-09-27 continuing daily deposited born digital 391 p. Table of Contents: AE 2.7: GS 4.107: AE 2.106: KF70.A2 https://www.govinfo.gov/app/details/FR-2011-09-27 P0b002ee180e1d95c 0097-6326 0042-1219 0364-1406 769-004-00000-9 000582072 f:fr27se11 https://www.govinfo.gov/app/details/FR-2011-09-27 https://www.govinfo.gov/content/pkg/FR-2011-09-27/pdf/FR-2011-09-27.pdf https://www.govinfo.gov/content/pkg/FR-2011-09-27/xml/FR-2011-09-27.xml fdlp 59501 59882 DGPO 2011-09-27 2024-06-04 FR-2011-09-27 machine generated eng FR FR-2011-09-27 76 187