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2011_register
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2011-06-22
article
Mandatory Reporting of Greenhouse Gases; Changes to Provisions for Electronics Manufacturing (Subpart I) To Provide Flexibility
Proposed Rules
D09002ee1bdd05a0a
D09002ee1bdd05ad6
United States
Environmental Protection Agency
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org
United States Government Agency or Subagency
EPA is proposing changes to the calculation and monitoring provisions in the Electronics Manufacturing portion (Subpart I) of the Mandatory Greenhouse Gas Reporting Rule for the ``largest'' semiconductor manufacturing facilities (i.e., those that fabricate devices on wafers measuring 300 millimeters or less in diameter and that have an annual manufacturing capacity of greater than 10,500 square meters). More specifically, for reporting years 2011 and 2012 this action proposes to allow the largest semiconductor facilities the option to calculate emissions using default emission factors already contained in Subpart I, instead of recipe-specific utilization and by- product formation rates (recipe-specific emission factors) for the plasma etching process type. These proposed changes are in response to a request for reconsideration of specific provisions submitted by the Semiconductor Industry Association. This action would only apply to the initial years of compliance while the Agency continues to better understand industry's concerns with Subpart I and considers longer-term alternative options.
76 FR 36472
https://www.govinfo.gov/app/details/FR-2011-06-22/2011-15651
2011-15651
fr22jn11-41
6560-50-P
EPA-HQ-OAR-2009-0927
FRL-9322-2
https://www.govinfo.gov/app/details/FR-2011-06-22/2011-15651
https://www.govinfo.gov/content/pkg/FR-2011-06-22/html/2011-15651.htm
https://www.govinfo.gov/content/pkg/FR-2011-06-22/pdf/2011-15651.pdf
Environmental Protection
Administrative Practice and Procedures
Air Pollution Control
Monitoring
Reporting and Recordkeeping
8 p.
36472
36479
76 FR 36472
Code of Federal Regulations
Title 40 Part 98
40 CFR Part 98
Mandatory Reporting of Greenhouse Gases; Changes to Provisions for Electronics Manufacturing (Subpart I) To Provide Flexibility; Federal Register Vol. 76, Issue
PRORULE
2011-15651
ENVIRONMENTAL PROTECTION AGENCY
2011-07-22
EPA-HQ-OAR-2009-0927
FRL-9322-2
6560-50-P
2011-15651
Proposed rule.
EPA is proposing changes to the calculation and monitoring provisions in the Electronics Manufacturing portion (Subpart I) of the Mandatory Greenhouse Gas Reporting Rule for the ``largest'' semiconductor manufacturing facilities (i.e., those that fabricate devices on wafers measuring 300 millimeters or less in diameter and that have an annual manufacturing capacity of greater than 10,500 square meters). More specifically, for reporting years 2011 and 2012 this action proposes to allow the largest semiconductor facilities the option to calculate emissions using default emission factors already contained in Subpart I, instead of recipe-specific utilization and by- product formation rates (recipe-specific emission factors) for the plasma etching process type. These proposed changes are in response to a request for reconsideration of specific provisions submitted by the Semiconductor Industry Association. This action would only apply to the initial years of compliance while the Agency continues to better understand industry's concerns with Subpart I and considers longer-term alternative options.
Comments. Comments must be received on or before July 22, 2011.
Ms. Carole Cook, Climate Change Division, Office of Atmospheric Programs (MC-6207J), Environmental Protection Agency, 1200 Pennsylvania Avenue, NW., Washington, DC 20460;
Environmental Protection
Administrative Practice and Procedures
Air Pollution Control
Monitoring
Reporting and Recordkeeping
Mandatory Reporting of Greenhouse Gases:
Changes to Provisions for Electronics Manufacturing to Provide Flexibility
,
GHGReportingFGHG@epa.gov
GHGReportingRule@epa.gov
http://www.epa.gov/climatechange/emissions/ghgrulemaking.html
http://www.epa.gov/climatechange/emissions/responses.html
http://www.regulations.gov
Federal Register
Vol. 76, no. 120
Office of the Federal Register, National Archives and Records Administration
2011-06-22
continuing
daily
deposited
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584 p.
Table of Contents:
AE 2.7:
GS 4.107:
AE 2.106:
KF70.A2
https://www.govinfo.gov/app/details/FR-2011-06-22
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0042-1219
0364-1406
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f:fr22jn11
https://www.govinfo.gov/app/details/FR-2011-06-22
https://www.govinfo.gov/content/pkg/FR-2011-06-22/pdf/FR-2011-06-22.pdf
https://www.govinfo.gov/content/pkg/FR-2011-06-22/xml/FR-2011-06-22.xml
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2011-06-22
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FR-2011-06-22
machine generated
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FR-2011-06-22
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