United States Government Publishing Office publisher pbl distributor dst United States National Archives and Records Administration Office of the Federal Register author aut Government Organization text government publication eng FR Regulatory Information 2003_register executive 2010-09-23 article Rules and Regulations D09002ee1c817cc4c D09002ee1c817ccd5 United States Environmental Protection Agency originator org United States Government Agency or Subagency This action promulgates national emission standards for hazardous air pollutants (NESHAP) for new and existing semiconductor manufacturing operations located at major sources of emissions of hazardous air pollutants (HAP). The final standards implement section 112(d) of the Clean Air Act (CAA), which requires the Administrator to regulate emissions of HAP listed in section 112(b) of the CAA. The intent of the standards is to protect public health and the environment by requiring new and existing major sources to control emissions to the level attainable by implementing the maximum achievable control technology (MACT). The primary HAP that will be controlled with this action include hydrochloric acid (HCl), hydrogen flouride (HF), methanol, glycol ethers, and xylene. Exposure to these substances has been demonstrated to cause adverse health effects such as irritation of the lung, eye, and mucous membranes; effects on the central nervous system; liver and kidney damage; and, possibly cancer. We do not have the type of current detailed data on each of the facilities and the people living around the facilities covered by today's final rule for this source category that would be necessary to conduct an analysis to determine the actual population exposures to the HAP emitted from these facilities and the potential for resultant health effects. Therefore, we do not know the extent to which the adverse health effects described above occur in the populations surrounding these facilities. However, to the extent the adverse effects do occur, and today's final rule reduces emissions, subsequent exposures will be reduced. 68 FR 27913 https://www.govinfo.gov/app/details/FR-2003-05-22/03-5519 03-5519 fr22my03-10 RIN 2060-AG93 6560-50-U OAR-2002-0086, FRL-7461-3 https://www.govinfo.gov/app/details/FR-2003-05-22/03-5519 https://www.govinfo.gov/content/pkg/FR-2003-05-22/html/03-5519.htm https://www.govinfo.gov/content/pkg/FR-2003-05-22/pdf/03-5519.pdf Environmental Protection Air Pollution Control Hazardous Substances Intergovernmental Relations Reporting and Recordkeeping Requirements 19 p. 27913 27931 68 FR 27913 Title 40 Part 63 40 CFR Part 63 RIN 2060-AG93 National Emission Standards for Hazardous Air Pollutants for Semiconductor Manufacturing; Federal Register Vol. 68, Issue RULE 03-5519 ENVIRONMENTAL PROTECTION AGENCY OAR-2002-0086, FRL-7461-3 6560-50-U 03-5519 Final rule.

This action promulgates national emission standards for hazardous air pollutants (NESHAP) for new and existing semiconductor manufacturing operations located at major sources of emissions of hazardous air pollutants (HAP). The final standards implement section 112(d) of the Clean Air Act (CAA), which requires the Administrator to regulate emissions of HAP listed in section 112(b) of the CAA. The intent of the standards is to protect public health and the environment by requiring new and existing major sources to control emissions to the level attainable by implementing the maximum achievable control technology (MACT). The primary HAP that will be controlled with this action include hydrochloric acid (HCl), hydrogen flouride (HF), methanol, glycol ethers, and xylene. Exposure to these substances has been demonstrated to cause adverse health effects such as irritation of the lung, eye, and mucous membranes; effects on the central nervous system; liver and kidney damage; and, possibly cancer. We do not have the type of current detailed data on each of the facilities and the people living around the facilities covered by today's final rule for this source category that would be necessary to conduct an analysis to determine the actual population exposures to the HAP emitted from these facilities and the potential for resultant health effects. Therefore, we do not know the extent to which the adverse health effects described above occur in the populations surrounding these facilities. However, to the extent the adverse effects do occur, and today's final rule reduces emissions, subsequent exposures will be reduced.

May 22, 2003. Mr. John Schaefer, U.S. EPA, Office of Air Quality Planning and Standards, Emission Standards Division (C504- 05), Research Triangle Park, NC 27711, telephone number (919) 541-0296, Environmental Protection Air Pollution Control Hazardous Substances Intergovernmental Relations Reporting and Recordkeeping Requirements Air pollutants, hazardous; national emission standards: Semiconductor manufacturing operations, auby.susan@epa.gov schaefer.john@epa.gov http://www.epa.gov/edocket/ http://www.epa.gov/fedrgstr/ http://www.epa.gov/icr http://www.epa.gov/ttn/oarpg http://www.epa.gov/ttn/oarpg/t5/memoranda/pte122.pdf Vol. 68, no. 99 Office of the Federal Register, National Archives and Records Administration 2003-05-22 continuing daily deposited born digital 229 p. Table of Contents: AE 2.7: GS 4.107: AE 2.106: KF70.A2 https://www.govinfo.gov/app/details/FR-2003-05-22 P0b002ee1809e3e9e 0097-6326 0042-1219 0364-1406 769-004-00000-9 000582072 f:fr22my03 https://www.govinfo.gov/app/details/FR-2003-05-22 https://www.govinfo.gov/content/pkg/FR-2003-05-22/pdf/FR-2003-05-22.pdf https://www.govinfo.gov/content/pkg/FR-2003-05-22/xml/FR-2003-05-22.xml fdlp 27891 28109 DGPO 2010-09-23 2024-06-07 FR-2003-05-22 machine generated eng FR FR-2003-05-22 68 99