[Federal Register Volume 88, Number 47 (Friday, March 10, 2023)]
[Notices]
[Pages 14978-14979]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2023-04964]


-----------------------------------------------------------------------

DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-19-2023]


Foreign-Trade Zone (FTZ) 138, Notification of Proposed Production 
Activity; Intel Corporation; (Semiconductor Products); New Albany, Ohio

    Intel Corporation submitted a notification of proposed production 
activity to the FTZ Board (the Board) for its facility in New Albany, 
Ohio, within Subzone 138I. The notification conforming to the 
requirements of the Board's regulations (15 CFR 400.22) was received on 
March 2, 2023.
    Pursuant to 15 CFR 400.14(b), FTZ production activity would be 
limited to the specific foreign-status material(s)/component(s) and 
specific finished product(s) described in the submitted notification 
(summarized below) and subsequently authorized by the Board. The 
benefits that may stem from conducting production activity under FTZ 
procedures are explained in the background section of the Board's 
website--accessible via www.trade.gov/ftz.
    The proposed finished products include semiconductor transducers, 
electronic integrated circuit processors and amplifiers, electronic 
memory circuits, and electronic integrated circuits (duty rates are 
duty-free).
    The proposed foreign-status materials and components include: 
methane (liquid; gas); chlorine; oxygen; hydrogen; helium; xenon; 
nitrogen; hydrochloric acid; hydrogen chloride; nitric acid; phosphoric 
acid; phosphoric acid based solution; hydrofluoric acid (also known as 
hydrogen fluoride); silicate reagent; hydrogen bromide; carbon dioxide; 
silica; carbon monoxide; dinitrogen monoxide (also known as nitrous 
oxide); nitric oxide; sulfur dioxide; boron trichloride; 
dichlorosilane; silane; silicon tetrachloride; chlorine trifluoride; 
diiodosilane; nitrogen trifluoride; anhydrous ammonia; ammonia; 
potassium hydroxide; potassium hydroxide based slurry; sulfur 
hexafluoride gas; tungsten hexafluoride; potassium hydroxide based 
slurry; sulfur hexafluoride gas; tungsten hexafluoride; titanium 
tetrachloride; carbonyl sulfide; copper sulphate solution; potassium 
chloride electrode filling solution; cerium hydroxide based slurry; 
hydrogen peroxide; disilane; n-octane; ethyne (also known as 
acetylene); hydrocarbon solution; trifluoromethane; tetrafluoromethane 
(also known as perfluoromethane); hexafluoro-1,3-butadiene; 
octafluorocyclobutane; isopropyl alcohol; tert-butyl alcohol; 
hexachlorodisilane; 2-heptanone; cyclohexanone; cyclopentanone; butyl 
acetate; propylene glycol monomethyl ether acetate (PGMEA); 
pentakis(dimethylamido)tantalum powder; 
tetrakis(methylethylamino)zirconium; N-methylethanolamine solution; 
tetramethylammonium hydroxide developer solution; 
bis(diethylamino)silane; hexamethyldisilazane photoresist; N,N-bis(1-
methylethyl)silanamine; tetramethylsilane; trimethylaluminum; 
trimethylsilane; butyrolactone; potassium chloride based solution; 
methyl 2-hydroxyisobutyrate based photoresist solution; PGMEA based 
photoresist solution; PGMEA based undercoat material; polyglycerol 
polymer based slurry; surfactant solution; butoxyethanol based wafer 
cleaning solution; ethanolamine based wafer cleaning solution; 1-
hydroxyethane-1,1-diphosphonic acid based wafer cleaning solution; bolt 
release lubrication; acetic acid based slurry; ammonium hydroxide based 
slurry; amorphous silica based slurry; cerium dioxide based slurry; 
potassium hydroxide based slurry; silica based slurry; 
tetraethylammonium hydroxide based slurry; silica and phosphoric acid 
based slurry; various mixtures (photoresist chemicals; diborane and 
argon; diborane and hydrogen; fluorine

[[Page 14979]]

and nitrogen; helium and nitrogen; helium based compressed gas; 
hydrogen and argon; hydrogen and helium; hydrogen and nitrogen; methane 
and argon; oxygen and helium; xenon and hydrogen); soldering, brazing, 
or welding powder; triethanolamine based solution; dimethyl sulfoxide 
based cleaning solvent; propylene glycol monomethyl ether based 
solvent; tetramethylammonium hydroxide based cleaning solvent; semi-
processed semiconductor wafers; 4-morpholinecarbaldehyde based 
solution; acetic acid based solution; ammonium fluoride based solution; 
benzotriazole based cleaning solution; cobalt based solution; ethylene 
glycol based solution; isobutyl propionate based developer solution; 
nitric acid based solution; phosphoric acid based solution; 
tetrahydrothiophene-1,1-dioxide based solution; anti-reflective 
photoresist chemical coating; melamine resin; ion exchangers; plastic 
components (cases; packing; bottles); ethylene bags; self-adhesive 
labels; quartz reactor tubes; copper anode discs; filtering machinery 
for liquids; permanent metal magnets; central processing units; 
microprocessors; electronic memory circuits; sputtering targets 
(cobalt; copper; tantalum; titanium); electrical conductors for a 
voltage not exceeding 1,000 V (fitted with connectors and used in 
telecommunication; not used in telecommunication); electrical 
conductors for a voltage not exceeding 80 V; insulated electrical 
conductors for a voltage not exceeding 1,000 V; copper electrical 
conductors for a voltage not exceeding 80 V; fitted electrical 
conductors for a voltage exceeding 1,000 V; and, electrical conductors 
for a voltage exceeding 1,000 V (duty rate ranges from duty-free to 
6.5%). The request indicates that certain materials/components are 
subject to duties under section 232 of the Trade Expansion Act of 1962 
(section 232) or section 301 of the Trade Act of 1974 (section 301), 
depending on the country of origin. The applicable section 232 and 
section 301 decisions require subject merchandise to be admitted to 
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions 
shall be addressed to the Board's Executive Secretary and sent to: 
[email protected]. The closing period for their receipt is April 19, 2023.
    A copy of the notification will be available for public inspection 
in the ``Online FTZ Information System'' section of the Board's 
website.
    For further information, contact Juanita Chen at 
[email protected].

    Dated: March 7, 2023.
Elizabeth Whiteman,
Acting Executive Secretary.
[FR Doc. 2023-04964 Filed 3-9-23; 8:45 am]
BILLING CODE 3510-DS-P