[Federal Register Volume 86, Number 223 (Tuesday, November 23, 2021)]
[Notices]
[Pages 66522-66523]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-25458]
-----------------------------------------------------------------------
DEPARTMENT OF COMMERCE
Foreign-Trade Zones Board
[B-77-2021]
Notification of Proposed Production Activity; Lam Research
Corporation; Foreign-Trade Zone (FTZ) 18--San Jose, California; (Wafer
Fabrication Equipment, Subassemblies, and Related Parts); Fremont,
Livermore, Newark, Tracy and Hayward, California
Lam Research Corporation (Lam) submitted a notification of proposed
production activity to the FTZ Board (the Board) for its facilities in
Fremont, Livermore, Newark, Tracy and Hayward, California within
Subzone 18F. The notification conforming to the requirements of the
Board's regulations (15 CFR 400.22) was received on November 10, 2021.
Pursuant to 15 CFR 400.14(b), FTZ production activity would be
limited to the specific foreign-status material(s)/component(s) and
specific finished product(s) described in the submitted notification
(summarized below) and subsequently authorized by the Board. The
benefits that may stem from conducting production activity under FTZ
procedures are explained in the background section of the Board's
website--accessible via www.trade.gov/ftz. The proposed finished
products and materials/components would be added to the production
authority that the Board previously approved for the operation, as
reflected on the Board's website.
The proposed finished products include: Chemical/mechanical
planarization and other wafer surface modification equipment; various
tools and process modules (for the chemical vapor or physical vapor
deposition, or plasma dry etch, of materials on a wafer; for the plasma
etch of the bevel edge of a wafer to remove yield-limiting residues and
defects of a wafers surface; for the stripping of photoresist material
on a wafer; for the ultraviolet thermal processing of a wafer surface;
for wafer cleaning between chip-processing steps to remove yield-
limiting residues and defects of a wafer surface) for semi-conductor
production; conductor material deposition process modules and machines
for wafer packaging; transport modules; wafer transport robots;
machines for the production of semiconductors, namely etch systems
installation, maintenance, repair, retrofit, and upgrade kits; machines
for manufacturing masks and assembling electronic circuits
installation, maintenance, repair, retrofit, and upgrade kits;
installation, maintenance, repair, retrofit, and upgrade kits (for
semiconductor equipment and parts and assemblies of semiconductor
equipment; chemical/mechanical planarization and other wafer surface
modification equipment; transport modules; wafer transport robots);
various tools and process modules (for the chemical vapor or physical
vapor deposition, or plasma dry etch, of materials on a wafer; for the
plasma etch of the bevel edge of a wafer to remove yield-limiting
residues and defects of a wafer surface; for the stripping of
photoresist material on a wafer; for the ultraviolet thermal processing
of a wafer surface; for wafer cleaning between chip-processing steps to
remove yield-limiting residues and defects of a wafer surface) for
semi-conductor production installation, maintenance, repair, retrofit,
and upgrade kits; and, conductor material deposition process modules
and machines for wafer packaging installation, maintenance, repair,
retrofit, and upgrade kits (duty rate is duty-free).
The proposed foreign-status materials and components include:
Synthetic petroleum-based hydrocarbon greases and similar synthetic
oils greases and similar synthetic oils; various sealants and adhesives
(polymer-based sealants, glues, and pastes; polyvinyl chloride (PVC)-
based sealants, glues, pastes, and cements; silicon-based sealants,
glues, pastes, and cements; polyglycol dimethacrylate sealants, glues,
pastes, and cements) used in the production and installation of
semiconductor manufacturing equipment; thermal transfer print ribbon
film; anti-static polyethylene bags used as packaging material; clear
nylon heat sealed bags; various components used for clean room
environments (disposable gloves made of nitrile synthetic rubber; tri-
polymer blend non-disposable gloves; non-textile, non-silicon anti-
static tissues and cleaning wipes with special surfactants); clear
acetate face shields and protective caps; high-density polyethylene
hard hats and protective caps; fused silica rods and pipes; linear
acting engine and motor components (air cylinders; steel, aluminum,
alumina ceramic, and/or plastic pins, pin lifters, and shims);
polypropylene, polyetheretherketone steel, and/or polycarbonate valve
covers; stainless steel, polyvinylidene difluoride (PVDF), and/or N-
Formylmethionine valve adapters; polytetrafluoroethylene (PTFE), PVDF,
polypropylene, PVC, plastic, and/or steel valve balls; aluminum, PVC,
and/or steel valve panels and plates; aluminum, perfluoroelastomer
polymer, and/or PTFE based TeflonTM composition valve doors;
steel, aluminum, alumina ceramic, and/or plastic valve pins;
fluorocarbon rubber, stainless steel, aluminum, morphous low modulus
rubber, and/or perfluoroelastomer polymer bodies, gate, transport and
loadlock valves, and valve parts specifically designed for
semiconductor applications; weldments tubing of semiconductor
manufacturing equipment tools; fluoroelastomer, aluminum, steel,
plastic, and/or fluoropolymer elastomer and synthetic rubber compound
rings, arms, cups, holders, plates, adapters, panels, pedestals, and
other inner components
[[Page 66523]]
designed specifically for semiconductor manufacturing equipment tools;
semiconductor manufacturing equipment sub-assemblies; structural
elements that may be composed of other metals, plastic or aluminum
enclosures or assemblies with threaded inserts, screws, dowel pins,
springs, and connectors for housings, enclosures, covers, and skins for
semiconductor manufacturing equipment; air and exhaust ducts, end
effectors, media dispensers designed specifically for semiconductor
manufacturing equipment; alkaline batteries; rod-type sheathed
cartridge heaters used to heat gases or liquids in distribution piping
for semiconductor manufacturing equipment; tube holders and mountings
of polyvinylidene fluoride, PVDF, other metals, or plastic materials;
incandescent lamps and bulbs; solid state devices consisting of a
light-emitting diode (LED) and photo diode; cables for voltage; and,
focal lenses used for factory inspections (duty rate ranges from duty-
free to 14%). The request indicates that certain materials/components
are subject to duties under Section 232 of the Trade Expansion Act of
1962 (Section 232) or Section 301 of the Trade Act of 1974 (Section
301), depending on the country of origin. The applicable Section 232
and Section 301 decisions require subject merchandise to be admitted to
FTZs in privileged foreign status (19 CFR 146.41).
Public comment is invited from interested parties. Submissions
shall be addressed to the Board's Executive Secretary and sent to:
[email protected]. The closing period for their receipt is January 3, 2022.
A copy of the notification will be available for public inspection
in the ``Online FTZ Information System'' section of the Board's
website.
For further information, contact Juanita Chen at
[email protected].
Dated: November 17, 2021.
Camille R. Evans,
Acting Executive Secretary.
[FR Doc. 2021-25458 Filed 11-22-21; 8:45 am]
BILLING CODE 3510-DS-P