[Federal Register Volume 86, Number 223 (Tuesday, November 23, 2021)]
[Notices]
[Pages 66522-66523]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-25458]


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DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-77-2021]


Notification of Proposed Production Activity; Lam Research 
Corporation; Foreign-Trade Zone (FTZ) 18--San Jose, California; (Wafer 
Fabrication Equipment, Subassemblies, and Related Parts); Fremont, 
Livermore, Newark, Tracy and Hayward, California

    Lam Research Corporation (Lam) submitted a notification of proposed 
production activity to the FTZ Board (the Board) for its facilities in 
Fremont, Livermore, Newark, Tracy and Hayward, California within 
Subzone 18F. The notification conforming to the requirements of the 
Board's regulations (15 CFR 400.22) was received on November 10, 2021.
    Pursuant to 15 CFR 400.14(b), FTZ production activity would be 
limited to the specific foreign-status material(s)/component(s) and 
specific finished product(s) described in the submitted notification 
(summarized below) and subsequently authorized by the Board. The 
benefits that may stem from conducting production activity under FTZ 
procedures are explained in the background section of the Board's 
website--accessible via www.trade.gov/ftz. The proposed finished 
products and materials/components would be added to the production 
authority that the Board previously approved for the operation, as 
reflected on the Board's website.
    The proposed finished products include: Chemical/mechanical 
planarization and other wafer surface modification equipment; various 
tools and process modules (for the chemical vapor or physical vapor 
deposition, or plasma dry etch, of materials on a wafer; for the plasma 
etch of the bevel edge of a wafer to remove yield-limiting residues and 
defects of a wafers surface; for the stripping of photoresist material 
on a wafer; for the ultraviolet thermal processing of a wafer surface; 
for wafer cleaning between chip-processing steps to remove yield-
limiting residues and defects of a wafer surface) for semi-conductor 
production; conductor material deposition process modules and machines 
for wafer packaging; transport modules; wafer transport robots; 
machines for the production of semiconductors, namely etch systems 
installation, maintenance, repair, retrofit, and upgrade kits; machines 
for manufacturing masks and assembling electronic circuits 
installation, maintenance, repair, retrofit, and upgrade kits; 
installation, maintenance, repair, retrofit, and upgrade kits (for 
semiconductor equipment and parts and assemblies of semiconductor 
equipment; chemical/mechanical planarization and other wafer surface 
modification equipment; transport modules; wafer transport robots); 
various tools and process modules (for the chemical vapor or physical 
vapor deposition, or plasma dry etch, of materials on a wafer; for the 
plasma etch of the bevel edge of a wafer to remove yield-limiting 
residues and defects of a wafer surface; for the stripping of 
photoresist material on a wafer; for the ultraviolet thermal processing 
of a wafer surface; for wafer cleaning between chip-processing steps to 
remove yield-limiting residues and defects of a wafer surface) for 
semi-conductor production installation, maintenance, repair, retrofit, 
and upgrade kits; and, conductor material deposition process modules 
and machines for wafer packaging installation, maintenance, repair, 
retrofit, and upgrade kits (duty rate is duty-free).
    The proposed foreign-status materials and components include: 
Synthetic petroleum-based hydrocarbon greases and similar synthetic 
oils greases and similar synthetic oils; various sealants and adhesives 
(polymer-based sealants, glues, and pastes; polyvinyl chloride (PVC)-
based sealants, glues, pastes, and cements; silicon-based sealants, 
glues, pastes, and cements; polyglycol dimethacrylate sealants, glues, 
pastes, and cements) used in the production and installation of 
semiconductor manufacturing equipment; thermal transfer print ribbon 
film; anti-static polyethylene bags used as packaging material; clear 
nylon heat sealed bags; various components used for clean room 
environments (disposable gloves made of nitrile synthetic rubber; tri-
polymer blend non-disposable gloves; non-textile, non-silicon anti-
static tissues and cleaning wipes with special surfactants); clear 
acetate face shields and protective caps; high-density polyethylene 
hard hats and protective caps; fused silica rods and pipes; linear 
acting engine and motor components (air cylinders; steel, aluminum, 
alumina ceramic, and/or plastic pins, pin lifters, and shims); 
polypropylene, polyetheretherketone steel, and/or polycarbonate valve 
covers; stainless steel, polyvinylidene difluoride (PVDF), and/or N-
Formylmethionine valve adapters; polytetrafluoroethylene (PTFE), PVDF, 
polypropylene, PVC, plastic, and/or steel valve balls; aluminum, PVC, 
and/or steel valve panels and plates; aluminum, perfluoroelastomer 
polymer, and/or PTFE based TeflonTM composition valve doors; 
steel, aluminum, alumina ceramic, and/or plastic valve pins; 
fluorocarbon rubber, stainless steel, aluminum, morphous low modulus 
rubber, and/or perfluoroelastomer polymer bodies, gate, transport and 
loadlock valves, and valve parts specifically designed for 
semiconductor applications; weldments tubing of semiconductor 
manufacturing equipment tools; fluoroelastomer, aluminum, steel, 
plastic, and/or fluoropolymer elastomer and synthetic rubber compound 
rings, arms, cups, holders, plates, adapters, panels, pedestals, and 
other inner components

[[Page 66523]]

designed specifically for semiconductor manufacturing equipment tools; 
semiconductor manufacturing equipment sub-assemblies; structural 
elements that may be composed of other metals, plastic or aluminum 
enclosures or assemblies with threaded inserts, screws, dowel pins, 
springs, and connectors for housings, enclosures, covers, and skins for 
semiconductor manufacturing equipment; air and exhaust ducts, end 
effectors, media dispensers designed specifically for semiconductor 
manufacturing equipment; alkaline batteries; rod-type sheathed 
cartridge heaters used to heat gases or liquids in distribution piping 
for semiconductor manufacturing equipment; tube holders and mountings 
of polyvinylidene fluoride, PVDF, other metals, or plastic materials; 
incandescent lamps and bulbs; solid state devices consisting of a 
light-emitting diode (LED) and photo diode; cables for voltage; and, 
focal lenses used for factory inspections (duty rate ranges from duty-
free to 14%). The request indicates that certain materials/components 
are subject to duties under Section 232 of the Trade Expansion Act of 
1962 (Section 232) or Section 301 of the Trade Act of 1974 (Section 
301), depending on the country of origin. The applicable Section 232 
and Section 301 decisions require subject merchandise to be admitted to 
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions 
shall be addressed to the Board's Executive Secretary and sent to: 
[email protected]. The closing period for their receipt is January 3, 2022.
    A copy of the notification will be available for public inspection 
in the ``Online FTZ Information System'' section of the Board's 
website.
    For further information, contact Juanita Chen at 
[email protected].

    Dated: November 17, 2021.
Camille R. Evans,
Acting Executive Secretary.
[FR Doc. 2021-25458 Filed 11-22-21; 8:45 am]
BILLING CODE 3510-DS-P