[Federal Register Volume 86, Number 80 (Wednesday, April 28, 2021)]
[Notices]
[Pages 22387-22389]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-08785]


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DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-31-2021]


Foreign-Trade Zone (FTZ) 45--Portland, Oregon; Notification of 
Proposed Production Activity; Lam Research Corporation (Semiconductor 
Production Equipment, Subassemblies and Related Parts), Tualatin and 
Sherwood, Oregon

    The Port of Portland, grantee of FTZ 45, submitted a notification 
of proposed production activity to the FTZ Board on behalf of Lam 
Research Corporation (Lam), located in Tualatin and Sherwood, Oregon. 
The notification conforming to the requirements of the regulations of 
the FTZ Board (15 CFR 400.22) was received on April 14, 2021.
    Lam already has authority to produce semiconductor production 
equipment, subassemblies and related parts within Subzone 45H. The 
current request would add finished products and foreign status 
materials/components to the scope of authority. Pursuant to 15 CFR 
400.14(b), additional FTZ authority would be limited to the specific 
foreign-status materials/components and specific finished products 
described in the submitted notification (as described below) and 
subsequently authorized by the FTZ Board.
    Production under FTZ procedures could exempt Lam from customs duty 
payments on the foreign-status materials/components used in export 
production. On its domestic sales, for the foreign-status materials/
components noted below and in the existing scope of authority, Lam 
would be able to choose the duty rates during customs entry procedures 
that apply to the finished products in its existing scope of authority 
and to the finished products listed below (duty free).
    Lam's proposed finished products include tools and process modules 
for--and installation, maintenance, repair, retrofit, and upgrade kits 
for tools and process modules for--the following: Chemical vapor 
deposition, physical vapor deposition, and plasma dry etch of materials 
on a wafer for semi-conductor production; plasma etch of the bevel edge 
of a wafer to remove yield-limiting residues and defects of a wafer 
surface for semi-conductor production; stripping of photoresist 
material on a wafer for semi-conductor production; ultraviolet thermal 
processing of a wafer surface for semi-conductor production; and, wafer 
cleaning between chip-processing steps to remove yield-limiting 
residues and defects of a wafer surface for semi-conductor production.
    Lam's proposed finished products also include installation, 
maintenance, repair, retrofit, and upgrade kits for the following: 
Machines for the production of semiconductors, namely etch systems; 
machines for manufacturing masks and assembling electronic circuits; 
semiconductor equipment and parts and assemblies; chemical/mechanical 
planarization and other wafer surface modification equipment; conductor 
material deposition process modules and machines for wafer packaging; 
transport modules; and, wafer transport robots.
    Finally, Lam's proposed finished products include: Chemical/
mechanical planarization and other wafer surface modification 
equipment; conductor material deposition process modules and machines 
for wafer packaging; transport modules; and, wafer transport robots. 
Lam would be able to avoid duty on foreign-status components which 
become scrap/waste. Customs duties also could possibly be deferred or 
reduced on foreign-status production equipment.

[[Page 22388]]

    The materials/components sourced from abroad include: Diluted 
hydrogen gas used for calibration; freon gas; ammonia hydroxide 
solutions; potassium phosphate buffer solutions; sodium bicarbonate 
buffer solutions; hydrogen peroxide; polyvinyl chloride (PVC) cement; 
mineral oils used as machine lubricants; synthetic petroleum-based 
hydrocarbon greases and similar synthetic oils and greases; thermal 
joint compounds; scouring pastes and powders used for wafer polishing 
activities; polymer-based sealants, glues, and pastes used in the 
production and installation of semiconductor manufacturing equipment; 
PVC-based sealants, glues, pastes, and cements used in the production 
and installation of semiconductor manufacturing equipment; silicon-
based sealants, glues, pastes, and cements used in the production and 
installation of semiconductor manufacturing equipment; polyglycol 
dimethacrylate sealants, glues, pastes, and cements used in the 
production and installation of semiconductor manufacturing equipment; 
thermal transfer print ribbon films; organic solvents for cleaning; 
sealants with activators; fluorine based coolants; epoxy resins; 
silicone cements and fillers; panels, plates, and simple structural 
components of plastics; cutting sheets of plastics; shims and simple 
spacers of plastics; foam block silicon adhesive; panels, plates, and 
simple structural components of rigid plastics; anti-static 
polyethylene bags used as packaging material; clear nylon heat sealed 
bags; plastic ductwork; heavy duty plastic gloves for acid protection; 
handles and levers of plastic used in semiconductor manufacturing 
equipment; hinges, mounts, latches, and brackets of plastic of a type 
for furniture; retaining rings of rubber; soft rubber tubing used in 
fluid/gas distribution; soft rubber tubing with fittings used in fluid/
gas distribution; vulcanized rubber belts used in wafer and equipment 
movement; disposable gloves made of nitrile synthetic rubber used for 
clean room environments; tri-polymer blend non-disposable gloves used 
for clean room environments; plastic tool containers; plastic case 
covers; silicone plastic tablet covers; non-textile, non-silicon 
antistatic tissues and cleaning wipes with special surfactants for use 
in clean room environments; paperboard and cardboard packaging 
materials; paperboard labels; schematics, diagrams, and similar 
technical drawings; right to use documentation; velcro tape, nylon line 
and nylon support sling (parts of kits that are installed onto wafer 
fabrication equipment systems); clear acetate face shields and 
protective caps; high-density polyethylene hard hats and protective 
caps; abrasive pads, disks and, strips for polishing semiconductor 
wafers; slurry troughs and similar ceramic dispensary articles; fused 
silica rods and pipes; safety glass windows; lamp bulbs; reflectors and 
collimators; fused silica and fused quartz components, disks, windows, 
liners, rings, tubes, holders, and funnels for laboratory semiconductor 
manufacturing equipment; beakers and similar lab equipment for holding/
conveying chemicals; viewports for laboratory semiconductor 
manufacturing equipment; fiberglass gaskets, spacers, and fasteners; 
fiberglass rings and washers for use in semiconductor manufacturing 
equipment process chambers; iron fittings for metal tubing used in 
fluid/gas distribution equipment; stainless steel butt weld fittings; 
stainless steel canisters and chemical tanks used for maintaining 
chemicals for semiconductor manufacturing equipment of 304 or 316L; 
stainless steel rope winches; steel support cables and wires--braided, 
used as structural elements in semiconductor manufacturing equipment; 
steel guard chains, driver chains, roller chains and links used in 
mechanical equipment for wafer manufacturing equipment or installation 
equipment; steel roller chains and other belt chains used in mechanical 
equipment for wafer manufacturing equipment or installation equipment; 
steel tie down straps; steel pins used as fasteners for semiconductor 
manufacturing equipment; steel eyebolts; steel leaf springs; cast steel 
brackets for support of semiconductor manufacturing equipment 
components; copper conductor bars for transmission of radio frequency 
(RF) energy; copper tubing used in fluid distribution in semiconductor 
manufacturing equipment process; copper pipe fittings; aluminum top hat 
rails and related clips; bus bars, ground bars, and rods of aluminum; 
aluminum tape; aluminum labels; vacuum port screens of aluminum; tin 
anodes for electrolytic processing of metals on wafers; tin anodes and 
pellets for electrolytic processing of metals on wafers; jab saws; 
hammers; insertion or extractions tool sets; helicoil or pipe tapping 
tools; retractable knives used in installation/maintenance of 
equipment; scissors used in installation/maintenance of equipment; 
metal latches with locks; hardware type brackets and mounts of metal; 
magnetically actuating cylinders; air cylinders for linear acting 
engines and motors; pins, pin lifters and, shims for linear acting 
engines and motors; hydraulic fluid power pumps; cryocompressors for 
fluid temperature control; condensers and compressors used in 
semiconductor manufacturing equipment; balancing scales; weight 
measurement equipment; weights for measurement equipment; fire 
suppression extinguishing systems; nozzles and orifices for fluid 
distribution system; hoists for wafer transport robots; scissor jacks; 
lift fixtures and lift fixtures parts for installation of semiconductor 
manufacturing equipment; calibration disks for semiconductor 
manufacturing equipment; barcode and thermal printers; slug buster 
punches; equipment chucks and fixtures for test and installation and 
related parts; electric drills, punches and, blades; helicoil repair 
kits; electric pipe and cable cutters; tablet docking stations; plates, 
pads, and lift fixtures, and related components of plastic, rubber, 
metal, thermoplastic polyetherimide (PEI) resins and 
polytetrafluoroethylene (PTFE) pins and materials; valve covers; valve 
adapters; valve ball; valve panels; valve doors; valve plates; valve 
pins; tapered roller bearings; needle roller bearings; cylindrical 
roller bearings; roller bearings, ball screws and, radial ball 
bearings; shafts, rollers, blocks and balls for bearings; chemical/
mechanical planarization and other wafer surface modification 
equipment; gate, transport and loadlock valves that are specifically 
designed for semiconductor applications; machines for manufacturing 
masks and assembling electronic circuits; weldments tubing of 
semiconductor manufacturing equipment tools; rings, arms, cups, 
holders, plates, adapters, panels, pedestals and other inner components 
designed specifically for semiconductor manufacturing equipment tools; 
semiconductor manufacturing equipment sub-assemblies; structural 
elements of other metals, plastic or aluminum enclosures or assemblies 
with threaded inserts, screws, dowel pins, springs, and connectors for 
housing, enclosures, covers, and skins for semiconductor manufacturing 
equipment; bodies and parts of gate, transport and loadlock valves that 
are specifically designed for semiconductor applications; air and 
exhaust ducts, end effectors and media dispensers designed specifically 
for semiconductor manufacturing equipment; DC motors with output >750 W 
and <=75 kW; AC motors with output >74.6 W and <=746

[[Page 22389]]

W; pistons, guards and similar motor components; electro-magnetic load 
coils and sensor magnets; alkaline batteries; lead storage batteries; 
nickel metal hybrid batteries; induction heaters for semiconductor 
manufacturing equipment; rod-type sheathed cartridge heaters used to 
heat gases or liquids in distribution piping for semiconductor 
manufacturing equipment; thermofoil used in heaters for semiconductor 
manufacturing equipment; input/output cards and panels for network 
equipment; load cell amplifiers, servo amplifiers and proximity 
amplifiers; digital video recorders; videos on DVD; flash memory cards; 
transponder readers; cathode-ray tube monitors for use with automatic 
data processing (ADP) machines; LCD color flat screen monitors for use 
with ADP machines; camera covers and holders of aluminum, stainless 
steel, other metals, and plastic materials; smoke detectors and 
sensors; sensors, lenses, frames and other parts of smoke detectors; 
aluminum electrolytic fixed capacitors; dielectric fixed capacitors; 
tube holders and mountings of polyvinylidene fluoride, polyvinylidene 
difluoride (PVDF), other metals, or plastic materials; connectors for 
optical cables; chassis, panels and boards for power distribution 
modules and similar controllers; supports, ferrules, fuse holders and 
similar parts of connectors; incandescent lamps and bulbs; discharge 
lamps other than UV lamps; light-emitting diode (LED) lamps used for 
illumination in semiconductor manufacturing equipment; electromagnetic 
interference (EMI) shield rings; semiconductor transistors used in 
electronic equipment; power block modules; semiconductor/crystal 
oscillators used in electronic equipment; solid state devices 
consisting of an LED and a photo diode; cables for voltage; graphite 
electrodes; insulators and insulator elements of quartz; focal lenses 
used for factory inspections; protective eyeglass frames; goggles and 
similar protective spectacles; compound optical microscopes; lasers for 
metrology and endpoint systems; optical light guide lenses; syringes; 
temperature monitors and hydrometers; thermocouple sensors or adapters; 
diaphragms, guards, adapters and gauges, vacuum filters and similar 
parts for flow and pressure meters; monochromators; digital counters; 
infrared sensors and radiation sensing equipment; multimeters; holding/
moving carts for power distribution equipment; fluorescent lamps 
fixtures; and, pens and markers (duty rate ranges from duty-free to 
20%). The request indicates that certain materials/components are 
subject to duties under Section 232 of the Trade Expansion Act of 1962 
(Section 232) or Section 301 of the Trade Act of 1974 (Section 301), 
depending on the country of origin. The applicable Section 232 and 
Section 301 decisions require subject merchandise to be admitted to 
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions 
shall be addressed to the Board's Executive Secretary and sent to: 
[email protected]. The closing period for their receipt is June 7, 2021.
    A copy of the notification will be available for public inspection 
in the ``Reading Room'' section of the Board's website, which is 
accessible via www.trade.gov/ftz.
    For further information, contact Christopher Wedderburn at 
[email protected].

    Dated: April 22, 2021.
Andrew McGilvray,
Executive Secretary.
[FR Doc. 2021-08785 Filed 4-27-21; 8:45 am]
BILLING CODE 3510-DS-P