[Federal Register Volume 65, Number 123 (Monday, June 26, 2000)]
[Notices]
[Page 39429]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 00-16003]



[[Page 39429]]

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DEPARTMENT OF JUSTICE

Antitrust Division


Notice Pursuant to the National Cooperative Research and 
Production Act of 1993--Die Products Consortium (``DPC'')

    Notice is hereby given that, on November 15, 1999, pursuant to 
section 6(a) of the National Cooperative Research and Production Act of 
1993, 15 U.S.C. 4301 et seq. (``the Act''), Die Products Consortium 
(``DPC'') has filed written notifications simultaneously with the 
Attorney General and the Federal Trade Commission disclosing (1) The 
identities of the parties and (2) the nature and objectives of the 
venture. The notifications were filed for the purpose of invoking the 
Act's provisions limiting the recovery of antitrust plaintiffs to 
actual damages under specified circumstances. Pursuant to section 6(b) 
of the Act, the identities of the parties are Amkor Technology, Inc., 
West Chester PA; Chip Supply, Inc., Orlando, FL; Cypress Semiconductor 
Corporation, San Jose, CA; Honeywell, Inc., Minneapolis, MN; Intel 
Corporation, Santa Clara, CA; Lucent Technologies, Inc., Murray Hill, 
NJ, Microelectronics and Computer Technology Corporation, Austin, TX; 
National Semiconductor Corporation, Santa Clara, CA; Rockwell Collins, 
Inc., Cedar Rapids, IA; Tempo Electronics, North Hollywood, CA; and 
Texas Instruments, Dallas, TX. The nature and objectives of the venture 
are to provide leadership to the microelectronics industry to promote 
methods for improved die product (including flip chip) quality, 
reliability, handling, shipping, and associated infrastructure at 
lowest cost to meet the needs of users for smaller form factor, higher 
performance, lower cost products.

Constance K. Robinson,
Director of Operations, Antitrust Division.
[FR Doc. 00-16003 Filed 6-23-00; 8:45 am]
BILLING CODE 4410-11-M