[Federal Register Volume 65, Number 119 (Tuesday, June 20, 2000)]
[Notices]
[Pages 38244-38245]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 00-15496]


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DEPARTMENT OF COMMERCE

National Institute of Standards and Technology


Notice of Prospective Grant of Exclusive Patent License

AGENCY: National Institute of Standards and Technology Commerce.

ACTION: Notice of Prospective Grant of Exclusive Patent License.

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SUMMARY: This is a notice in accordance with 35 U.S.C. 209(c)(1) and 37 
CFR 404.7(a)(1)(i) that the National Institute of Standards and 
Technology (``NIST''), U.S. Department of Commerce, is contemplating 
the grant of an exclusive license in the United States of America, its 
territories, possessions and commonwealths, to NIST's interest in the 
invention embodied in U.S. Patent Application 09/016,668, titled, 
``Temperature Calibration Wafer For Rapid Thermal Processing Using 
Thin-Film Thermocouples'', filed January 27, 1998; NIST Docket No. 97-
021US to Claud S. Gordon Co., having a place of business at 5710 
Kenosha St., Richmond, IL. The grant of the license would be for the 
field of use of Semiconductor Manufacturing.

FOR FURTHER INFORMATION CONTACT: J. Terry Lynch, National Institute of 
Standards and Technology, Office of Technology Partnerships, Building 
820, Room 213, Gaithersburg, MD 20899.

SUPPLEMENTARY INFORMATION: The prospective exclusive license will be 
royalty-bearing and will comply with the terms and conditions of 35 
U.S.C. 209 and 37 CFR 404.7. The prospective exclusive license may be 
granted unless, within sixty days from the date of this published 
Notice, NIST receives written evidence and argument which establish 
that the grant of the license would not be consistent with the 
requirements of 35 U.S.C. 209 and 37 CFR 404.7. The availability of the 
invention for licensing was published in the Federal Register, Vol. 63, 
No. 42 (March 4, 1998).
    U.S. Patent application 09/016,668 is owned by the U.S. Government, 
as represented by the Secretary of Commerce. The present invention 
enables the measurement of temperature and the calibration of 
temperature measurements in rapid thermal processing tools for silicon 
wafer processing to a greater accuracy than previously possible. The 
invention is a device which is a calibration wafer of novel 
construction and capabilities. The calibration wafer is comprised of an 
array of junctions of thin film thermocouples which traverse the

[[Page 38245]]

silocon wafer (typically 300 mm in diameter) and are welded to 
thermocouple wires of the same composition as the thin films. The 
advantages of very low mass thin-film thermocouples in making these 
measurements are greatest under the extremely high heat flux conditions 
present in rapid thermal processing tools (100 w/cm2). In order to 
achieve these measurements with thin-film thermocouples at temperatures 
ranging up to 900 degrees celsius a novel approach was taken in the 
design and fabrication of the wafer including the incorporation of an 
adhesion film for the thermoelements, diffusion barriers, and high 
temperature dielectric insulators.

    Dated: June 8, 2000.
Karen H. Brown,
Deputy Director.
[FR Doc. 00-15496 Filed 6-19-00; 8:45 am]
BILLING CODE 3510-13-M