[Federal Register Volume 62, Number 89 (Thursday, May 8, 1997)]
[Notices]
[Page 25173]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 97-11977]


-----------------------------------------------------------------------

DEPARTMENT OF COMMERCE

National Institute of Standards and Technology


Notice of a Government Owned Invention Available for Licensing

SUMMARY: The invention listed below is owned by the U.S. Government, as 
represented by the Department of Commerce, and is available for 
licensing on only a non-exclusive basis in accordance with 35 U.S.C. 
207 and 37 CFR Part 404 to achieve expeditious commercialization of 
results of federally funded research and development.

FOR FURTHER INFORMATION CONTACT: Technical and licensing information on 
this invention may be obtained by writing to: National Institute of 
Standards and Technology, Industrial Partnerships Program, Building 
820, Room 213, Gaithersburg, MD 20899; Fax 301-869-2751. Any request 
for information should include the NIST Docket No. and Title for the 
relevant invention as indicated below.

SUPPLEMENTARY INFORMATION: NIST may enter into one or more Cooperative 
Research and Development Agreements (``CRADA'') with the licensees to 
perform further research on the invention for purposes of 
commercialization. NIST may grant licensees an option to negotiate for 
exclusive royalty-bearing licenses to any jointly owned inventions 
which arise from the CRADAs as well as an option to negotiate for 
exclusive royalty-bearing licenses for NIST employee inventions which 
arise from the CRADAs.
    The invention available for licensing is:
    NIST Docket Number: 96-009.
    Title: Interferometric Thickness Variation Test Method For Windows 
and Sili.
    Abstract: This interferometric apparatus and non-contact method 
measure central thickness and thickness variations of silicon wafers 
and other window-like optics by using a diverging wavefront and an 
infrared interferometer operating at a wavelength to which silicon is 
transparent. The speed and accuracy of the invention offer cost-
effective measurements of 300 mm wafers.

    Dated: May 1, 1997.
Elaine Bunten-Mines,
Director, Program Office.
[FR Doc. 97-11977 Filed 5-7-97; 8:45 am]
BILLING CODE 3510-13-M