[Federal Register Volume 60, Number 76 (Thursday, April 20, 1995)]
[Notices]
[Page 19779]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 95-9801]



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DEPARTMENT OF JUSTICE

Notice Pursuant to the National Cooperative Research and 
Production Act of 1993--Universal Instruments Corporation

    Notice is hereby given that, on January 16, 1995, pursuant to 
Section 6(a) of the National Cooperative Research and Production Act of 
1993, 15 U.S.C. 4301 et seq. (``the Act''), Universal Instruments 
Corporation has filed written notifications simultaneously with the 
Attorney General and the Federal Trade Commission disclosing (1) the 
identities of the parties and (2) the nature and objectives of the 
venture. The notifications were filed for the purpose of invoking the 
Act's provisions limiting the recovery of antitrust plaintiffs to 
actual damages under specified circumstances. Pursuant to Section 6(b) 
of the Act, the identities of the parties are: Apple Computer Corp., 
Cupertino, CA; Allen-Bradley, Milwaukee, WI; AMD, Incorporated, 
Sunnyvale, CA; Amkor-Anam, Chandler, AZ; AT&T Bell Labs, Allentown, PA; 
Bosch, Ansbach-brodswinden, GERMANY; Bull, Brighton, MA; Cabletron 
Systems, Inc., Rochester, NH; DEK Printing Machines, Ltd., Dorset, 
ENGLAND; Delco Electronics, Kokomo, IN; DOVatron International, 
Binghamton, NY; Eastman Kodak, Rochester, NY; Hadco, Salem, NH; Hewlett 
Packard, Palo Alto, CA; Intel Corporation, Chandler, AZ; LSI Logic, 
Milpitas, CA; Magnetic Marelli, Pavia, ITALY; Motorola, Schaumburg, IL; 
MPM Corporation, Franklin, MA; Plexus Corporation, Neenah, WI; Texas 
Instruments, Dallas, TX; and Universal Instruments Corporation, 
Binghamton, NY.
    The nature and objectives of the joint venture are to investigate 
the problems associated with the attachment of Ball Grid Array (BGA) 
and Flip Chip (DCA) components to printed circuit boards for the 
development of new products in the electronics industry. The two 
technologies to be addressed are the process, component and material 
variables in: (1) BGA attachment with a lead pitch from 0.5-1.5mm with 
eutectic and 10/90 Sn/Pb solder balls; and (2) DCA attachment with a 
lead pitch from 0.18-0.05mm with eutectic and 10/90 Sn/Pb solder bumps.
Constance K. Robinson,
Director of Operations, Antitrust Division.
[FR Doc. 95-9801 Filed 4-19-95; 8:45 am]
BILLING CODE 4410-01-M