[Congressional Record (Bound Edition), Volume 154 (2008), Part 16]
[Extensions of Remarks]
[Page 21896]
[From the U.S. Government Publishing Office, www.gpo.gov]




                          EARMARK DECLARATION

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                           HON. STEVE CHABOT

                                of ohio

                    in the house of representatives

                     Wednesday, September 24, 2008

  Mr. CHABOT. Madam Speaker, pursuant to the Republican Leadership 
standards on earmarks, I am submitting the following information for 
publication in the Congressional Record regarding earmarks I received 
as part of H.R. 2638 the Consolidated Security, Disaster Assistance, 
and Continuing Appropriations Act, 2009.
  The Electrofluidic Chromatophores for Adaptive Camouflage project is 
listed under account 3 0601103A, the University Research Initiative for 
$1,750,000. The project is requested by the University of Cincinnati 
located at 836A Rhodes Hall, Cincinnati, OH 45221-0030. The University 
of Cincinnati is in the process of developing an electro-optical system 
based on electrowetting technology that can change the color of a 
reflective surface electronically. This project would allow the Armed 
Forces to change its camouflage pattern electronically at any time. 
Funds will be used for a two year research project with annual federal 
expenditures of approximately $1,750,000 million, divided among the 
University of Cincinnati and Motorola labs. These funds will support 
approximately two graduate students and one post-doctoral students at 
the University of Cincinnati for electrowetting module fabrication and 
development, 2.5 Motorola engineers and one Motorola technician for 
printed electronics development, module fabrication, and housing 
integration, and one Sun Chemical scientist for advanced pigment 
development. This is intended as a two year federal research project 
under the Army's R&D R-1 account, line 3 ``University Research 
Initiative,'' to initiate an Adaptive Camouflage Surfaces R&D Program 
at the University of Cincinnati.
  The Smart Machine Platform Initiative is listed under account 179 
0708045A, End Item Industrial Preparedness Activities for $4,000,000 
million. The project is requested by TechSolve Inc, located at 6705 
Steger Drive, Cincinnati, OH 45237. Smart Machine Platform Initiative 
will advance the state of the art in manufacturing and fabrication of 
components for weapons systems and reduce cost and cycle time. The 
vision for this requirement is the addition of intelligence to the 
machining process. The project will provide $4 million in the 
Consolidated Security, Disaster Assistance, and Continuing 
Appropriations Act, 2009, under PE#0708045, Line 179--End Item 
Industrial Preparedness Activities, only for the Smart Machine Platform 
Initiative. Zero (0)% matching funds are listed because the Smart 
Machine Platform Initiative is a Research and Development Activity.

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