[Congressional Record Volume 172, Number 113 (Monday, July 13, 2026)]
[Senate]
[Pages S3782-S3783]
From the Congressional Record Online through the Government Publishing Office [www.gpo.gov]

  SA 6585. Mr. RICKETTS (for himself and Mr. Kim) submitted an 
amendment intended to be proposed by him to the bill S. 4784, to 
authorize appropriations for fiscal year 2027 for military activities 
of the Department of Defense, for military construction, and for 
defense activities of the Department of Energy, to prescribe military 
personnel strengths for such fiscal year, and for other purposes; which 
was ordered to lie on the table; as follows:

       At the end of subtitle G of title X, add the following:

     SEC. 1094. MULTILATERAL ALIGNMENT OF CONTROLS ON 
                   SEMICONDUCTOR MANUFACTURING EQUIPMENT.

       (a) Identifying Chokepoints.--Not later than 60 days after 
     the date of the enactment of this Act, and annually 
     thereafter, the Under Secretary of Commerce for Industry and 
     Security, in coordination with the Secretary of State, 
     shall--
       (1) conduct a review to identify all covered semiconductor 
     manufacturing equipment and all covered facilities;
       (2) submit to the appropriate congressional committees a 
     list of all such equipment and facilities; and
       (3) notify the public in the Federal Register when this 
     submission has occurred.
       (b) Diplomatic Engagement.--
       (1) In general.--The Under Secretary of Commerce for 
     Industry and Security and the Secretary of State should 
     continue to prioritize and encourage the governments of 
     allied supplier countries to adopt--
       (A) countrywide controls, or other policies that have the 
     same practical effect as countrywide controls, on covered 
     semiconductor manufacturing equipment that are subject to the 
     jurisdiction of such allied supplier country; and
       (B) license requirements, with a policy of presumption of 
     denial, for the export, reexport, or in-country transfer of 
     all applicable items to any covered facility and for the 
     servicing of all applicable items at any covered facility.
       (2) Briefing on diplomatic efforts.--Not later than 90 days 
     after the date of the enactment of this Act, the Under 
     Secretary of Commerce for Industry and Security and the 
     Secretary of State shall jointly provide to members of the 
     appropriate congressional committees a briefing to describe 
     the status of diplomatic efforts to align the controls on 
     covered semiconductor manufacturing equipment imposed by 
     allied supplier countries with the controls imposed by the 
     United States.
       (3) Certification on allied supplier countries.--Except as 
     provided in subsection (c)(3), for each allied supplier 
     country, the Under Secretary of Commerce for Industry and 
     Security and the Secretary of State shall jointly certify, 
     not later than 150 days after the date of the enactment of 
     this Act, to the appropriate congressional committees that 
     either--
       (A) the country has implemented the controls described in 
     subparagraphs (A) and (B) of paragraph (1); or
       (B)(i) the country has not adopted the controls described 
     in subparagraph (A) or (B) of paragraph (1);
       (ii) the Under Secretary of Commerce for Industry and 
     Security and the Secretary of State have prioritized and 
     exhausted available diplomatic channels; and
       (iii) continued delay would materially undermine the 
     national security of the United States.
       (c) Controls on United States Equipment and Extension of 
     Controls.--
       (1) Application of controls on united states equipment.--
     Not later than 150 days after the date of the enactment of 
     this Act, and annually thereafter, the Under Secretary of 
     Commerce for Industry and Security shall issue regulations 
     that--
       (A) update United States countrywide controls to covered 
     semiconductor manufacturing equipment produced in the United 
     States; and
       (B) update comprehensive United States end-user or end-use 
     restrictions to all covered facilities located in a country 
     of concern.
       (2) Extension of controls to allied supplier countries.--
       (A) In general.--Except as provided in subparagraph (B), 
     for any allied supplier country for which a certification is 
     submitted under subsection (b)(3)(B), the Under Secretary of 
     Commerce for Industry and Security shall issue regulations, 
     not later than the date of the submission of such 
     certification, that--
       (i) establish United States jurisdiction over covered 
     semiconductor manufacturing equipment and applicable items 
     exported, reexported, or in-country transferred from, or 
     produced in, such country; and
       (ii) apply--

       (I) countrywide controls to all covered semiconductor 
     manufacturing equipment produced in such country;
       (II) a license requirement, subject to a presumption of 
     denial, for the servicing of any applicable item located in a 
     covered facility; and
       (III) end-user and end-use controls prohibiting the export, 
     reexport, or in-country transfer of an applicable item to any 
     covered facility.

       (B) Deferral for anticipated alignment.--If, on or before 
     the deadline described in subparagraph (A), the Under 
     Secretary of Commerce for Industry and Security and the 
     Secretary of State jointly submit to the appropriate 
     congressional committees a report certifying that the allied 
     supplier country subject to subparagraph (A) has committed to 
     adopt, or is otherwise expected to adopt, controls that have 
     the same practical effect as those described in subsection 
     (b)(1), the Under Secretary of Commerce for Industry and 
     Security may issue a one-time deferral of the effective date 
     of the regulations described in subsection (A) for a period 
     of not longer than 30 days from the date described in 
     subparagraph (A).
       (3) National security waiver.--The Under Secretary of 
     Commerce for Industry and Security and the Secretary of State 
     may jointly grant a one-time waiver to extend the 150-day 
     deadline for the issuing of controls pursuant to paragraph 
     (1) or paragraph (2) by not more than 90 days, if the Under 
     Secretary of Commerce for Industry and Security and the 
     Secretary of State jointly--
       (A) submit a report to the appropriate congressional 
     committees describing--
       (i) the justification for why the deadline could not be 
     met; and
       (ii) the interim steps taken to prevent stockpiling; and
       (B) determine and certify to the appropriate congressional 
     committees that--
       (i) the extension is in the national security interest of 
     the United States; and
       (ii) if applicable, the government of the allied supplier 
     country is taking concrete, verifiable steps, pursuant to 
     their domestic laws and regulations and as expeditiously as 
     possible, to adopt controls that have the same practical 
     effect as, or are more stringent than, the controls that 
     would otherwise be imposed under paragraph (2).
       (d) Report.--
       (1) In general.--Not later than 180 days after the date of 
     the enactment of this Act, and annually thereafter, the Under 
     Secretary of Commerce for Industry and Security and the 
     Secretary of State shall jointly submit to the appropriate 
     congressional committees a report that includes--
       (A) the scope of the export controls imposed by the United 
     States and allied supplier countries on any covered 
     semiconductor manufacturing equipment identified in the most 
     recent list submitted under subsection (a);
       (B) a summary of diplomatic engagements and unilateral 
     actions undertaken by the Secretaries in the one-year period 
     prior to the submission of the report to close any gap in 
     countrywide controls imposed by allied supplier countries for 
     covered semiconductor manufacturing equipment; and
       (C) a certification that the export, reexport, or in-
     country transfer of any covered semiconductor manufacturing 
     equipment to a country of concern, the export of any 
     applicable items to any covered facility, and the servicing 
     of any such item located in a country of concern is 
     prohibited or requires a license issued by the United States 
     or an allied supplier country, subject to a presumption of 
     denial.
       (2) Form.--Each report submitted under paragraph (1) shall 
     be submitted in unclassified form but may include a 
     classified annex.
       (e) Nonpublication of Confidential Certifications and 
     Reports.--
       (1) In general.--The Under Secretary of Commerce for 
     Industry and Security and the Secretary of State, as 
     applicable, may elect to submit to the appropriate 
     congressional committees any certification and report 
     described in subsection (a), (c), or (d) in a confidential 
     manner.
       (2) Committee safeguards.--The appropriate congressional 
     committees shall take such steps as may be necessary to 
     ensure that any certification or report submitted in a 
     confidential manner is not made publicly available.
       (f) Compliance Assistance With Extension of Controls.--
     Simultaneously with the issuing regulations under subsection 
     (c)(2), the Under Secretary of Commerce for Industry and 
     Security may provide to the principal executive officers of 
     any company that produces covered semiconductor manufacturing 
     equipment in the allied supplier country targeted in such 
     regulations a letter describing the regulations and the legal 
     obligations imposed by the regulations, including

[[Page S3783]]

     any penalty that may be imposed under section 1760 of the 
     Export Control Reform Act of 2018 ( 50 U.S.C. 4819) for a 
     violation of such regulations.
       (g) Termination and Reimposition of Controls Upon Allied 
     Action.--
       (1) Termination or modification.--The Under Secretary of 
     Commerce for Industry and Security may terminate or modify 
     any regulation issued under subsection (c)(2), if the country 
     has established controls, including licensing policies, that 
     have the same practical effect as the regulation to be 
     terminated or modified.
       (2) Reimposition.--If, after terminating or modifying a 
     control under paragraph (1), the Under Secretary of Commerce 
     for Industry and Security determines that the allied supplier 
     country has materially weakened, suspended, or revoked the 
     control that justified the termination or modification under 
     paragraph (1), the Under Secretary shall, not later than 60 
     days after making such determination--
       (A) notify the appropriate congressional committees of such 
     determination; and
       (B) reimpose the control under subsection (c)(2) that was 
     terminated or modified under paragraph (1).
       (h) Administrative Procedures.--The provisions of section 
     1762 of the Export Control Reform Act of 2018 (50 U.S.C. 
     4821) shall apply to this section in the same manner and to 
     the same extent as such provisions apply to the Export 
     Control Reform Act of 2018 (50 U.S.C. 4801 et seq.).
       (i) Definitions.--In this section:
       (1) The term ``advanced-node integrated circuits'' has the 
     meaning given that term in section 772.1 of the Export 
     Administration Regulations as in effect on January 1, 2026.
       (2) The term ``allied supplier country'' means any country 
     that--
       (A) is not a country of concern; and
       (B) is engaged in the production of covered semiconductor 
     manufacturing equipment.
       (3) The term ``applicable item'' means any item that is or 
     can be made subject to the Export Administration Regulations, 
     including--
       (A) a United States-origin item;
       (B) a foreign-produced item that is the direct product of, 
     or produced by plants or major components that are the direct 
     product of, United States-origin software or technology 
     subject to the Export Administration Regulations;
       (C) a foreign-produced item with more than zero percent de 
     minimis United States-origin content; and
       (D) a foreign-produced item that contains United States-
     origin or foreign-produced integrated circuits that are 
     presumptively designed or produced, directly or indirectly, 
     with technology, software, or equipment that is subject to 
     the Export Administration Regulations.
       (4) The term ``appropriate congressional committees'' 
     means--
       (A) the Committee on Banking, Housing, and Urban Affairs 
     and the Committee on Foreign Relations of the Senate; and
       (B) the Committee on Foreign Affairs of the House of 
     Representatives.
       (5) The term ``capabilities comparable to those of the 
     product sold by the global market leader'' means, considering 
     cost, throughput, reliability, precision, and any other 
     relevant factors, advanced-node integrated circuit makers 
     headquartered outside of countries of concern, when selecting 
     a tool for use in high-volume manufacturing, would be 
     indifferent about using, or would prefer to use, the tool 
     produced by the country of concern, rather than a tool sold 
     by the company with the greatest share of the global market 
     for tools used to accomplish the same function.
       (6) The term ``country of concern'' has the meaning given 
     the term ``covered nation'' in section 4872(f) of title 10, 
     United States Code.
       (7) The term ``countrywide controls'' means, with respect 
     to semiconductor manufacturing equipment, a licensing 
     requirements, with a policy of presumption of denial, for the 
     export, reexport, or in-country transfer of the item to or in 
     a country of concern, and a licensing requirement, with a 
     policy of presumption of denial, for the servicing of the 
     item located in a country of concern, excluding exports, 
     reexports, in-country transfers or servicing where the 
     destination is a fabrication facility that existed as of the 
     date of the enactment of this Act and remains owned and 
     operated by a company headquartered, and the ultimate parent 
     company of which is headquartered, outside of any country of 
     concern.
       (8) The term ``covered facility'' means--
       (A) a facility engaged in the production of advanced-node 
     integrated circuits which is owned or operated by an entity 
     headquartered in, or whose ultimate parent company is 
     headquartered in, a country of concern; or
       (B) any facility owned or operated by, or in common 
     ownership or control with--
       (i) Semiconductor Manufacturing International Corporation;
       (ii) Hua Hong Semiconductor Limited;
       (iii) Huawei Technologies Company;
       (iv) ChangXin Memory Technologies;
       (v) Yangtze Memory Technologies Corporation;
       (vi) any producer, manufacturer, or developer of 
     semiconductor manufacturing equipment that is headquartered 
     in, or the ultimate parent company of which is headquartered 
     in, a country of concern; or
       (vii) any entity that is a subsidiary or affiliate of or a 
     successor to any entity described in clauses (i) through 
     (vi).
       (9) The term ``covered semiconductor manufacturing 
     equipment''--
       (A) means semiconductor manufacturing equipment or a 
     component therefor that--
       (i) is an applicable item; and
       (ii) the Under Secretary of Commerce for Industry and 
     Security and the Secretary of State jointly determine that no 
     country of concern produces in sufficient volumes and with 
     capabilities comparable to those of the product sold by the 
     global market leader, as of the date of the enactment of this 
     Act; and
       (B) includes, at a minimum--
       (i) all deep ultraviolet immersion photolithography 
     machines, through silicon via deposition and etch tools, 
     cryogenic etch equipment, and cobalt deposition equipment; 
     and
       (ii) all semiconductor manufacturing equipment or 
     components specified in Export Control Classification Number 
     3B001 or 3B002, or equipment meeting the parameters of Export 
     Control Classification Number 3B993.f.1 (excluding the 
     parameters described in 3B993.F.1.b2), as in effect on 
     January 1, 2026, except any item the Under Secretary of 
     Commerce for Industry and Security and the Secretary of State 
     jointly determine does not meet the requirements of 
     subparagraph (A).
       (10) The terms ``export'', ``in-country transfer'', 
     ``reexport'', and ``Export Administration Regulations'' have 
     the meanings given such terms in section 1742 of the Export 
     Control Reform Act of 2018 (50 U.S.C. 4801).
       (11) The term ``in sufficient volumes'' means in volumes 
     sufficient to meet 75 percent of current demand from all 
     countries of concern.
       (12) The term ``servicing'' means any servicing of 
     equipment or components, whether in-person or remote, 
     including installation, calibration, repair, overhauling, 
     refurbishing, testing, diagnosing, updating software or 
     firmware, training, field services, application support 
     engineering, customization, technical assistance, process 
     adjustments, troubleshooting, and transfer of industry best 
     practices for maintenance.
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