[Congressional Record Volume 172, Number 106 (Wednesday, June 24, 2026)]
[Senate]
[Page S3513]
From the Congressional Record Online through the Government Publishing Office [www.gpo.gov]

  SA 6390. Ms. CORTEZ MASTO submitted an amendment intended to be 
proposed by her to the bill S. 4784, to authorize appropriations for 
fiscal year 2027 for military activities of the Department of Defense, 
for military construction, and for defense activities of the Department 
of Energy, to prescribe military personnel strengths for such fiscal 
year, and for other purposes; which was ordered to lie on the table; as 
follows:

       In section 1248, strike subsection (c) and insert the 
     following
       (a) Covered AI Chip Defined.--In this section, the term 
     ``covered AI chip'' means any advanced integrated circuit, 
     computer, or other product that--
       (1)(A) is designed by or manufactured using technology 
     originating in the United States, including items produced 
     abroad using intellectual property, design software, or 
     semiconductor manufacturing equipment originating in the 
     United States; and
       (B)(i) is classified or classifiable under Export Control 
     Classification Number 3A090, 4A090, 5A002.z, related .z 
     Export Control Classification Numbers, or any successor 
     classification; or
       (ii) is an item that is functionally equivalent to an item 
     classified or classifiable as described in clause (i);
       (2) an integrated circuit, computer, or other product that 
     is--
       (A) classified under Export Control Classification Number 
     3A090 or 4A090 or related Export Control Classification 
     Numbers; or
       (B) functionally equivalent or substantially similar to a 
     circuit, computer, or product described in subparagraph (A); 
     or
       (3) an integrated circuit that has one or more digital 
     processing units with--
       (A) a total processing performance of 4,800 or more;
       (B) a total processing performance of 2,400 or more and a 
     performance density of 1.6 or more;
       (C) a total processing performance of 1,600 or more and a 
     performance density of 3.2 or more; or
       (D) a total DRAM bandwidth of 1,400 gigabytes per second or 
     more, interconnect bandwidth of 1,100 gigabytes per second or 
     more, or a sum of DRAM bandwidth and interconnect bandwidth 
     of 1,700 gigabytes per second or more.
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