[Congressional Record Volume 172, Number 106 (Wednesday, June 24, 2026)]
[Senate]
[Page S3473]
From the Congressional Record Online through the Government Publishing Office [www.gpo.gov]

  SA 6345. Mr. SCHUMER (for himself and Mr. Cotton) submitted an 
amendment intended to be proposed by him to the bill S. 4784, to 
authorize appropriations for fiscal year 2027 for military activities 
of the Department of Defense, for military construction, and for 
defense activities of the Department of Energy, to prescribe military 
personnel strengths for such fiscal year, and for other purposes; which 
was ordered to lie on the table; as follows:

       At the end of subtitle E of title VIII, add the following:

     SEC. 885. PROHIBITION ON ACQUISITION OF CERTAIN SILICON 
                   CARBIDE-BASED SEMICONDUCTORS MANUFACTURED IN 
                   CHINA.

       (a) Restrictions on Silicon Carbide Wafer Sourcing.--The 
     Secretary of Defense shall revise section 252.225 of the 
     Department of Defense Supplement to the Federal Acquisition 
     Regulation to prohibit the procurement of semiconductors, 
     other than commercially available off-the-shelf items (as 
     defined in section 104 of title 41, United States Code), that 
     are manufactured on silicon carbide wafers that are 
     manufactured in the Peoples Republic of China. Such revision 
     may provide the authority for the Secretary to issue a waiver 
     on a case-by-case basis.
       (b) Briefing on Financial Instruments.--Not later than 180 
     days after the date of the enactment of this Act, the 
     Secretary of Defense and the Deputy Secretary of Defense 
     shall conduct a review, and provide to the congressional 
     defense committees a briefing on the results of such a 
     review, of domestic manufacturers of silicon carbide wafers 
     that are critical to the Department of Defense and that are 
     facing challenges due to Chinese exports of such wafers.
       (c) Briefing on Establishment of Common Foundries.--Not 
     later than 180 days after the date of the enactment of this 
     section, the Secretary of Defense provide to the 
     congressional defense committees a briefing that evaluates 
     the merits of encouraging major prime contractors in the 
     defense industrial base to consolidate silicon carbide 
     semiconductor design and fabrication operations in common 
     commercial foundries to encourage economies of scale and 
     quality improvements.
       (d) Consultation With the Chips Program Office.--The 
     Secretary shall provide information to the Secretary of 
     Commerce and other appropriate Federal agency heads on the 
     use of Research and Development amounts to develop silicon 
     carbide-related manufacturing technology for manufacturing 
     high-purity single crystal silicon carbide boules, ingots, 
     and wafers at 300mm scale for purposes of--
       (1) developing next-generation high-voltage technology; and
       (2) advancing state-of-the-art packaging power modules.
       (e) Policy on Interagency Deliberations.--Not later than 90 
     days after the date of the enactment of this section, the 
     Secretary of Defense shall issue a policy for recommendations 
     for interagency consideration in deliberations on encouraging 
     allied and partner countries to ensure the silicon carbide 
     substrate supply chains of such countries for national 
     security systems and critical infrastructure do not include 
     Chinese-manufactured silicon carbide wafers.
                                 ______